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Does anyone know the TPD (Thermal Deisgn Power) for the s912 chip or a heatsink they have had success with.
Im trying to work out a heatsink that would be able to keep the chip cool under load with passive cooling because my current 40x40x5 is letting the box get to 90c with lid on and 75 with lid off.
Only know for S905:
- Package junction to case thermal resistance in nature convection Θjc = 9.42 °C/Watt
- Junction Temperature TJ=0 to 125°C
- Operating Temperature TA= 0 to 70°C
- For operating temperature, good heat sink may be needed to guarantee Tj < 125°C
Operating temperature outside of this values cause reduced live.
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