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Originally posted by michalw2 View Post
Originally posted by michalw2 View Post
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Originally posted by Scooby-Doo View PostDid you change the power supply?
Maybe you have malfunction in your PMIC or a very bad cpu!
I've already implemented passive cooling (2xheatsinks, thermal pads) but unfortunately to my surprise I'm not satisfied with results. Temp can get to 70+ 'C when playing 1080p 60fps video (with GFX boost turned off). But I was so convinced that final results will be great that I've forgotten to check the temp with original setup. Now I can't compare. I don't have baseline. Crap.
Also I've got the feeling that the bottom metal plate of the box is even warmer now than it was before.
But I think that it's a symptom of using thermal pad which job is to absorb as much a heat as possible. So I think it's a good symptom.
I'm planning to place bigger thermal pad to cover more area at the bottom (on the opposite side of CPU).
But anyway - say if I want to install active cooling. Do I connect 5V or 12V power cable (depends of a fan) inside or outside the box? Nowhere I can see any socket I could use inside the box. I could use USB port for power (but 5V only).Last edited by michalw2; 15 March 2015, 15:13.
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Originally posted by michalw2 View PostThanks for all advices!
I've already implemented passive cooling (2xheatsinks, thermal pads) but unfortunately to my surprise I'm not satisfied with results. Temp can get to 70'C when playing 1080p 60fps video (with GFX boost turned off). But I was so convinced that final results will be great that I've forgotten to check the temp with original setup. Now I can't compare. I don't have baseline. Crap.
I'm planning to place bigger thermal pad on the opposite side of CPU.
But anyway - say if I want to install active cooling. Do I connect 5V or 12V cable (depends of a fan) inside or outside the box? Nowhere I can see any socket I could use inside the box. I could use USB port for power (but 5V only).
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Originally posted by michalw2 View PostThanks for all advices!
I've already implemented passive cooling (2xheatsinks, thermal pads) but unfortunately to my surprise I'm not satisfied with results. Temp can get to 70'C when playing 1080p 60fps video (with GFX boost turned off). But I was so convinced that final results will be great that I've forgotten to check the temp with original setup. Now I can't compare. I don't have baseline. Crap.
I'm planning to place bigger thermal pad on the opposite side of CPU.
But anyway - say if I want to install active cooling. Do I connect 5V or 12V cable (depends of a fan) inside or outside the box? Nowhere I can see any socket I could use inside the box. I could use USB port for power (but 5V only).
fan is not useful i tried it and no actual effect i tried it with laptop small 5V and only make it faster to drop from high temp but it's not preventing it from get overheat
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Originally posted by scropion86 View Postdid you fix it with the attached heatsink body , i think no room for that in the box
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Hi and sorry for some questions about the Thermal Pads:
- I see they come with different thickness up to 4 mm. The thicker the better ?
- Then i guess one side is sticky and i have to peel off some kind of plastic foil in order to place it ?
- Brand is important ? or any would do just fine ?
- If understand rightly pads are for the bottom and heatsinks for the top metal cover above the cpu. Have i got it right ?
Thanks a lot indeed.With the kindest regards, geppo
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1. no, thinner is better... if I remember correctly you need 1mm to replace the one between CPU etc. and metal plate/cover
2. maybe, but they also exists without any adhesive (which you can use at 1.)
3. no, but W/mk (higher is better)
4. If you want to use it a botton (under the PCB) you need 5mm because auf the space/room between pcb and case (of course also 5 x 1mm is possible)... if you want to use it for heatsink at the metal plate/cover then thinner is better and adhesive at both sides...RK3288 Devices
- Overview BOX (LINK !)
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MINIX NEO: Z64 W/A - (Intel Z3735F); X8-H Plus - (Amlogic S812H); A2 Lite (sponsored by minix.com.hk)
UGOOS UT3S (4/32GB with fan) - FW 2.0.6 - (RK3288) (sponsored by GearBest.com)
Tronsmart Draco AW80 Meta (2/16GB) - FW v2.0rc3 - (Allwinner A80) (sponsored by GeekBuying.com)
Beelink / UBOX R89 - FW 111k4110_1219 - (RK3288) (sponsored by Netxeon (Beelink))
RK3188: pcb => "CH001 1332 TN-BX09_V2.1" (K-R42 / CS918...) => wasser KK 1.0.3 (old rev)
Fly Mouse Mini Wireless Keyboard with 2 mode learning IR remote 'iPazzPort KP-810-16'
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Originally posted by no_spam_for_me View Post1. no, thinner is better... if I remember correctly you need 1mm to replace the one between CPU etc. and metal plate/cover
I think that this thermic issue is really the key point because with the right bios settings this unit is very ok as a multi-purpose little but complete PC.
Maybe it is limited for 3D video gaming or video editing ... but those are high end applications.
But for HTPC it is fantastic, thermal issue aside.
2. maybe, but they also exists without any adhesive (which you can use at 1.)
3. no, but W/mk (higher is better)
4. If you want to use it a botton (under the PCB) you need 5mm because auf the space/room between pcb and case (of course also 5 x 1mm is possible)...
We cannot have everything i understand.
if you want to use it for heatsink at the metal plate/cover then thinner is better and adhesive at both sides...
I would prefer not to stick anything to the components on the board.
Maybe i am wrong i have to check but this thermal pads could work more efficiently if slightly compressed.
So maybe 2mm above the motherboard and 5mm below should work just fine, and sticked both to the case. As a first move i will open and look at the circuits.
perfectly clear. Thanks a lot indeed !With the kindest regards, geppo
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OK, I have got cheap thermal pad (5 mm) and waiting for heatsink.
Thermal pad at bottom side is fantastic!
Without thermal pad normal temperature was about 60 °C. LinX (Linpack, best CPU burn software) warmed up SoC up to 86 °C (trottling) in 1 min 30 sec.
With thermal pad normal temperature is about 50 °C. LinX needs 15 min 25 sec to burn (up to trottling) SoC!
AIDA and software 1080p decoding can not warm up CPU anymore.
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Originally posted by Kyrie View PostOK, I have got cheap thermal pad (5 mm) and waiting for heatsink.
Thermal pad at bottom side is fantastic!
Without thermal pad normal temperature was about 60 °C. LinX (Linpack, best CPU burn software) warmed up SoC up to 86 °C (trottling) in 1 min 30 sec.
With thermal pad normal temperature is about 50 °C. LinX needs 15 min 25 sec to burn (up to trottling) SoC!
AIDA and software 1080p decoding can not warm up CPU anymore.
I am very willing to pay for it, if it is reliable of course.
I am using Core Temp ... and i have got already bad opinions about its reliablity.
The T stays around 35C max for all 4 cores ... so maybe i am laughing while heading for destruction. I am very ignorant ...
Thanks a lot.With the kindest regards, geppo
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