Beelink R89 --RK3288 Cortex-A17 Mali-T7 4Kx2K RGMII HDMI2.0 supported by ODM&developers

[Haba]

I can't edit this post now,why?Help,Bob...

OK,I have chosen 18 people for the R89 testing,they are :
no_spam_for_me ,bloodgnome,LawlessPPC,4WheelSpyder,ssspacman ,ademturk ,Arbelzapf ,talas ,NikAmi ,goldenrod ,TMx ,sync ,sweup,Smokez,ENDRJUPL,clarkss12,Catadarius,tltest er..

Thank them!

And we still want two more,totally 20.Others are for Developers.

The current state:
1.R89 can be powered on,but RK still don't release their complete SDK.We are doing some debugging and testing now.

Do you expect RK to release the complete SDK in the future?

[oman]

回复: Beelink R89 --RK3288 Cortex-A17 Mali-T7 4Kx2K RGMII HDMI2.0 supported by ODM&developers

Do you expect RK to release the complete SDK in the future?

Yes,next week we will get that

来自我的 GT-I9300 上的 Tapatalk

[endera]

I can't edit this post now,why?Help,Bob...

OK,I have chosen 18 people for the R89 testing,they are :
no_spam_for_me ,bloodgnome,LawlessPPC,4WheelSpyder,ssspacman ,ademturk ,Arbelzapf ,talas ,NikAmi ,goldenrod ,TMx ,sync ,sweup,Smokez,ENDRJUPL,clarkss12,Catadarius,tltest er..

and endera.................vs..

Thank them!

And we still want two more,totally 20.Others are for Developers.

The current state:
1.R89 can be powered on,but RK still don't release their complete SDK.We are doing some debugging and testing now.

OK,I have chosen 18 people for the R89 testing,they are :
no_spam_for_me ,bloodgnome,LawlessPPC,4WheelSpyder,ssspacman ,ademturk ,Arbelzapf ,talas ,NikAmi ,goldenrod ,TMx ,sync ,sweup,Smokez,ENDRJUPL,clarkss12,Catadarius,tltest er..

and endera

[LawlessPPC]

Ok just my thoughts.

The bigger the heatsink the better (it would be nice to cover as much of the ram chips as possible to help cool them down as well) and the more conductive the metal the better so a copper heatsink is a lot better than an aluminium one. The greater the surface area of the heatsink the better also so the higher the villi or cooling fins the greater the surface area equalling even better cooling. Then as others have stated please use thermal compound (artic silver) as its far more conductive than any tape type solution but only as long as the heatsink has retention clips or a fixing bracket which it does at the moment. Also make some small vents on the base of the unit along with vents on the top of the unit this will cause cool air to be drawn in at the base as the heat rises and escapes out of the top by convection current. Wifi chip i would choose one that does 2.4 &5 Ghz its worth the additional cost. An antenna would be a good idea for the wifi also. Best way to test any networking speeds is to use iPerf available on nearly every platform. Do we know the spec of the NAND? How finalized is the pcb design?

[oman]

Ok just my thoughts.

The bigger the heatsink the better (it would be nice to cover as much of the ram chips as possible to help cool them down as well) and the more conductive the metal the better so a copper heatsink is a lot better than an aluminium one. The greater the surface area of the heatsink the better also so the higher the villi or cooling fins the greater the surface area equalling even better cooling. Then as others have stated please use thermal compound (artic silver) as its far more conductive than any tape type solution but only as long as the heatsink has retention clips or a fixing bracket which it does at the moment. Also make some small vents on the base of the unit along with vents on the top of the unit this will cause cool air to be drawn in at the base as the heat rises and escapes out of the top by convection current. Wifi chip i would choose one that does 2.4 &5 Ghz its worth the additional cost. An antenna would be a good idea for the wifi also. Best way to test any networking speeds is to use iPerf available on nearly every platform. Do we know the spec of the NAND? How finalized is the pcb design?

First,thank you for your advise.

Yep,you know,a product might achieve balance between cost and performance.

I know use the bigger heatsink ,with copper,and higher fins,thermal compound,vents,it will better for thermal solution.But it will increase cost,and maybe only decrease 2~3 degree?

The first thing I ask for my boss is use thermal compound,he agreed.
And for vents,because our case is already modified,it's not easy to change.If so many people care about this,my boss will pay attention to this. Pls show your attitude here to my boss.
For others,we must discuss.Copper is much more expensive than aluminium ,with less cooling effect.

Nand is Micron 8G now,but I am not sure which will be used in the final mass production .

[bloatman]

pick me

I Would like to be considered for beta test. I have owned an mx1, cx919, t428, mk908, cs868, a1000g, cs918, q7 and a b4a. I also have a ifc6410 QUALCOMM development board on order. I have dolby/dts receiver, Bluetooth mouse and headset, f10 pro controller, fiber optic 50mbs internet and Panasonic 3d tv.

[Arbelzapf]

Well I guess it's not very wise to make decisions about cooling if you're not yet able to even run this thing at full clock speed.

Then only tests can show what is the most appropriate solution.

If there's a way to improve the cooler at a reasonable budget, I am certainly going to prefer that. We've all seen TV Boxes and sticks with thermal issues and it's not something that's easy to solve for the end user.

[Boris Blank]

As long as the heatsink can be swapped out by the end user if they wish, then stick to the cheaper one (makes good business sense).

I'd add support to including vents prior to release as end-user case modification could be quite difficult for those without the skills or right tools.

[goldenrod]

The R89 is compatible with 3 wifi chips:

1.AP6210 --b/g/n
2.AP6330 --a/b/g/n/ --base AP6210 +3$
3.AP6335 --b/g/n/ac --base AP6330 +3$

Wow, an AC option! That is fantastic and will put those new AC routers to the test.

[eduardosmelo]

The R89 is compatible with 3 wifi chipP6210 --b/g/n
2.AP6330 --a/b/g/n/ --base AP6210 +3$
3.AP6335 --b/g/n/ac --base AP6330 +3$

I would like to see its working ROM.
Besides, custom settings are a must for me.

[d33]

Wow, an AC option! That is fantastic and will put those new AC routers to the test.

AP6335 is still single transmit single receive but is capable of 80MHz channel so theorectically can reach 433 mbps. Way better than AP6330 which is single transmit 20MHz channel (72 Mbps max.).

Definately my preference.


AP6210: WiFi 2.4G/BT4.0 WiFi 1T1R (65 Mbps)
AP6330: WiFi 2.4G,5G/BT4.0/FM，WiFi 1T1R (72.2Mbps)

AP6234: WiFi2.4G,5G/BT4.0，WiFi 1T1R (150Mbps)
AP6335: WiFi 11ac 2.4G,5G/BT4.0/FM，WiFi 1T1R (433Mbps)

[oman]

We plan to add vents.

[Arbelzapf]

We plan to add vents.

Nice to hear!

[ssspacman]

We plan to add vents.

Great!

[oman]

If anyone have some good and reasonable advise ,just let me know.